Patent · US Expired

Intergranular degradation assessment via random grain boundary network analysis

US6397682B2 · kind B2 · utility

13Cited by
10References
4Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 9, 2001
Grant dateJun 4, 2002
Priority date
Expiry dateFeb 9, 2021

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01N17/006
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method is disclosed for determining the resistance of polycrystalline materials to intergranular degradation or failure (IGDF), by analyzing the random grain boundary network connectivity (RGBNC) microstructure. Analysis of the disruption of the RGBNC microstructure may be assess the effectiveness of materials processing in increasing IGDF resistance. Comparison of the RGBNC microstructures of materials exposed to extreme operating conditions to unexposed materials may be used to diagnose and predict possible onset of material failure due to

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.