Intergranular degradation assessment via random grain boundary network analysis
US6397682B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2001 |
| Grant date | Jun 4, 2002 |
| Priority date | — |
| Expiry date | Feb 9, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N17/006
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method is disclosed for determining the resistance of polycrystalline materials to intergranular degradation or failure (IGDF), by analyzing the random grain boundary network connectivity (RGBNC) microstructure. Analysis of the disruption of the RGBNC microstructure may be assess the effectiveness of materials processing in increasing IGDF resistance. Comparison of the RGBNC microstructures of materials exposed to extreme operating conditions to unexposed materials may be used to diagnose and predict possible onset of material failure due to
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.