Heat dissipating apparatus and method for electronic components
US6397944B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 28, 2000 |
| Grant date | Jun 4, 2002 |
| Priority date | — |
| Expiry date | Jan 28, 2020 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2210/10
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A method and apparatus dissipates heat generated by an electronic device. The apparatus includes a channel structure that is in thermal communication with heat generated by the electronic device. The apparatus further includes a pump array operative to advance fluid within the channel structure. In addition, the apparatus includes a baffle array positionable in relation to the channel structure in a first group position and a second group position, wherein fluid advancing within the channel structure is diverted to flow (i) in a first flow path defined in the channel structure when the baffle array is positioned in the first group position, and (ii) in a second flow path defined in the channel structure when the baffle array is positioned in the second group position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.