Sheet-framed IC carrier, method for producing the same, and IC carrier case
US6398114B1 · kind B1 · utility
53Cited by
9References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1997 |
| Grant date | Jun 4, 2002 |
| Priority date | — |
| Expiry date | Oct 30, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.