Contact structure of lead
US6398561B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 11, 2001 |
| Grant date | Jun 4, 2002 |
| Priority date | — |
| Expiry date | Jul 11, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A contact structure of a lead in which a contact structure having a lead and a bump made of suitable metals, respectively, can be formed easily and the bump and the lead can be soundly connected together in terms of electricity and strength. The contact structure of the lead comprises a lead 12 formed by etching a conductive foil 11, and a bump 5 formed by electric casting by means of plating. The bump 5 and the lead 12 are formed of different metals, respectively, and the bump 5 is connected to a surface of the lead 12 through a conductive connecting material 10. The lead 12 is intimately contacted at a surface, on which the bump 5 is disposed, with a first main surface 15 of a holeless insulative sheet 8. A basal portion of the bump 5 is forcibly pierced into and extended all the way through the thickness of a material of the holeless insulative sheet 8 and a side surface of the basal portion of the bump 5 is fusion-adhered to an inner wall surface of the through-hole 17. A distal portion of the bump 5 is projected from a second main surface 16 of the insulative sheet 8.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.