Method for clamping and electrostatically coating a substrate
US6399143B1 · kind B1 · utility
44Cited by
16References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 10, 1998 |
| Grant date | Jun 4, 2002 |
| Priority date | — |
| Expiry date | Jun 10, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05B5/032
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
The disclosure relates to an apparatus for electrostatically adhering grains to a planar substrate comprising:a. an electrostatic chuck having a collection surface with at least one grain collection zone for, when the planar substrate is layered on the collection surface, electrostatically directing charged grains to a corresponding surface on the planar substrate; andb. a pattern of holes through the electrostatic chuck allowing a source of low pressure to act through the electrostatic chuck to adhere the planar substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.