Die attachment utilizing grooved surfaces
US6399182B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2000 |
| Grant date | Jun 4, 2002 |
| Priority date | — |
| Expiry date | Apr 12, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24942
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate for a microelectronic package comprising a substrate that has grooves on a surface for bonding. A method for preparing a substrate for bonding comprising forming a grooved surface in the substrate for accepting a die for bonding, wherein the grooves are of sufficient size to provide a substantially uniform die bond, but no so large as to nullify the thermal path to the underlying substrate. A method for forming a bond between a substrate and a die comprising: providing a substrate and a die, wherein the substrate has grooves formed in a surface area for accepting the die for bonding and having a metallization thereon sufficient to form a eutectic bond with the die having a gold metallization thereon; and forming a eutectic bond between the substrate and the die comprising heating the substrate, contacting the metallized grooved surface of the substrate to the gold metallized surface of the die, scrubbing the die onto the substrate by moving the die back and forth while maintaining contact, and cooling the substrate and die. A microelectronic structure comprising a substrate and a die, wherein the substrate has grooves on a surface adapted for bonding with the die, and w…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.