Radiation sensitive resin composition and use of the same in an interlaminar insulating film
US6399267B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2000 |
| Grant date | Jun 4, 2002 |
| Priority date | — |
| Expiry date | Jul 26, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0233
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A radiation sensitive resin composition which can be processed and molded at low temperatures and has resolution, solvent resistance, adhesion to a substrate and storage stability required as an interlaminar insulating film.This radiation sensitive resin composition comprises:(A) a copolymer obtained by copolymerizing (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride, (a2) an epoxy compound such as &bgr;-methylglycidyl acrylate and/or an epoxy compound such as a monomer represented by the following formula (3):  and (a3) an olefinic unsaturated compound other than the above (a1) and (a2); and(B) a 1,2-quinonediazide compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.