Photopolymerizable thermosetting resin composition
US6399277B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 1998 |
| Grant date | Jun 4, 2002 |
| Priority date | — |
| Expiry date | Dec 28, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/287
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photopolymeriziable thermosetting resin composition comprising (A) a mixture consisting of (a) an active energy ray-setting resin and obtained by reacting an unsaturated monobasic acid copolymer resin with a cycloaliphatic epoxy group-containing unsaturated compound or reacting a cycloaliphatic epoxy group containing copolymer resin with an acid group-containing unsaturated compound and (b) an photosensitive prepolymer obtained by esterifying a novolak type epoxy compound with an alpha-beta-unsaturated carboxylic acid and then further reacting with polybasic acid anhydride (and in one embodiment further reacting with an unsaturated isocyanate).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.