Input stage ESD protection for an integrated circuit
US6400204B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 26, 2000 |
| Grant date | Jun 4, 2002 |
| Priority date | — |
| Expiry date | Jul 26, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/611
Abstract
An integrated circuit is disclosed in which a steering diode is coupled between an input bond pad and a ground bond pad. The steering diode is reverse biased when a voltage applied to the input bond pad exceeds the voltage at the ground bond pad. A circuit coupled between the input bond pad and the ground bond pad includes a transistor having a first electrode coupled the input bond pad and a second electrode coupled to the ground bond pad. There may be other circuit elements between the emitter and the ground bond pad. At least two series coupled diodes are coupled between the input bond pad and the ground bond pad. The at least two series coupled diodes provide ESD protection to the transistor and circuit coupled between the input bond pad and the ground bond pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.