Integrated circuit chip supporting and electrically connecting a head slider
US6400529B1 · kind B1 · utility
16Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2000 |
| Grant date | Jun 4, 2002 |
| Priority date | — |
| Expiry date | Mar 20, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/4853
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A head assembly has a head slider including a magnetic head and a first electrode, an IC chip supporting the head slider on a principal surface of the IC chip, and a suspension supporting the IC chip, the IC chip comprising a second electrode and a third electrode on the principal surface thereof, the third electrode being connected to the suspension, the second electrode being electrically connected to the first electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.