Thermally conductive interface member
US6400565B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2000 |
| Grant date | Jun 4, 2002 |
| Priority date | — |
| Expiry date | Apr 21, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package including a printed circuit substrate having a semiconductor device mounted thereon. A heat dissipating device is attached to the semiconductor device. A thermal interface member is mounted between the semiconductor device and the heat dissipating device. The thermal interface member includes a thermally conductive elastomeric pad and a layer of thermally conductive phase change material attached to a surface of the elastomeric pad. The elastomeric pad is engaged with a surface of the semiconductor device and the phase change material is engaged with a surface of the heat dissipating device. Heat transfer from the semiconductor device to the heat dissipating device is significantly increased. The heat dissipating device can be detached from the semiconductor device without destroying the thermal transfer member, allowing the thermal interface member to be reused with the heat dissipating device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.