Method and device for three-dimensional arrangement of wire and method of manufacturing conductive material
US6401333B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2000 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Jun 8, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49158
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method and apparatus (10) are used for manufacturing a wire structure wherein a wire (13) is three-dimensionally aligned at prescribed pitches. The method comprises the steps of providing one or more frame bodies (12) which have a prescribed thickness, peripherally of a rotary shaft (11). By rotating rotary shaft (11) about a rotation axis thereof, wires (13) are wound, at prescribed pitches, around frame bodies (12). Another frame body (12) is stacked on at least one existing frame body and wire (13) is wound thereon at prescribed pitches. The above steps are repeated to yield a wire structure having a wire aligned three-dimensionally and accurately at prescribed pitches.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.