Lead frame tooling design for exposed pad features
US6401765B1 · kind B1 · utility
6Cited by
3References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2000 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Aug 22, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A modular tool for forming features in an exposed pad having a pad surface between a bleed groove and an edge of the pad surface in a lead frame including a first tool for forming a bottom of the exposed pad under the pad surface, a second tool coupled to the first tool for forming a side of the exposed pad, and a third tool coupled to the first tool for forming another side of the exposed pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.