Tape automated bonding circuit for use with an ink jet cartridge assembly in an ink jet printer
US6402299B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 1999 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Oct 22, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/14024
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An ink jet cartridge assembly for use in an ink jet printer has a body with at least one inner ink chamber. A printhead is carried by the body and has a plurality of ink jetting orifices in fluid communication with the ink chamber. A tape automated bonding circuit carried by the body includes a flexible tape and a plurality of electrical traces. The flexible tape includes a chip window with a peripheral edge. The printhead is disposed within the chip window at a distance from the peripheral edge. Each electrical trace has a bottom side adjacent the body, a substrate held portion carried by the flexible tape, a free trace portion extending between the peripheral edge of the chip window and the printhead, and a printhead held portion connected with the printhead. The tape automated bonding circuit further includes a photoimagable coating which covers the bottom side of each electrical trace on all of the substrate held portion and the free trace portion, but does not cover the printhead held portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.