Process tube having slit type process gas injection portion and hole type waste gas exhaust portion, and apparatus for fabricating semiconductor device
US6402849B2 · kind B2 · utility
54Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2001 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Feb 26, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B25/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A semiconductor device fabrication apparatus is provided for increasing the deposition rate of a film. The apparatus includes a process tube. Process gas injection portions in a slit configuration and waste gas exhaust portions formed as holes are integrated into the interior of the body of the process tube.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.