Magnetic polishing fluids for polishing metal substrates
US6402978B1 · kind B1 · utility
14Cited by
8References
80Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 4, 2000 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | May 4, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Magnetic polishing fluid compositions for polishing metal substrates containing colloidal and/or non-colloidal magnetic particles are described. The compositions contain oxidizers and, for example, oxidation inhibitors for assisting in the polishing process. Colloidal polishing particles may also be employed. The compositions are usually highly acidic. Methods for preparing the various polishing fluids compositions are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.