Low adhesion semi-conductive electrical shields
US6402993B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 26, 2001 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Jul 26, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B9/027
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A low adhesion semiconductive dielectric shield for use with cross-linked polyethylene, ethylene-propylene rubber or ethylene-propylene-diene rubber (EPDM rubber) insulation. The dielectric shield comprises a base polymer which is a copolymer of ethylene with a mono-unsaturated ester; a conductive filler in an amount sufficient to give an electrical resistivity below 550 ohms-meter and as an adhesion adjusting device an ethylene vinyl acetate, ethylene alkyl acrylate or ethylene alkyl methacrylate copolymer having a molecular weight above 20,000 daltons and a polydispersity greater than 2.5 wherein the adhesion between the insulation and the semiconductive shield is between about 3-26 lbs per ½inch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.