Heat-sensitive stencil and method of fabricating same
US6403150B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 5, 2000 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Jul 30, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249986
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A heat-sensitive stencil having a thermoplastic resin film, and a porous resin layer formed thereon. The stencil has an air permeability in the range of 1.0 cm3/cm2·sec to 157 cm3/cm2·sec in a portion thereof when the thermoplastic resin film of the portion is perforated to form perforations providing an open ratio SO/SP of at least 0.2, wherein SO represents a total area of the perforations and SP represents the area of the portion. The heat-sensitive stencil is prepared by applying a coating liquid containing the resin of the porous resin layer to the thermoplastic resin film and drying the coating. The coating liquid contains a mixture of a good solvent and a poor solvent less vaporizable than the good solvent so that the porous resin layer is formed after drying.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.