Adhesive transfer device for making repositionably adherable substrates
US6403185B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1999 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Jun 30, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2984
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to an adhesive transfer device for selectively making a repositionably adherable substrate from a selected substrate. The device comprises a base substrate, a layer of pressure-sensitive repositionable adhesive disposed on the base substrate, a layer of pressure-sensitive permanent adhesive disposed adjacent to the repositionable adhesive layer opposite the base substrate, and structure providing a release surface. The release surface is removably engaged with the permanent adhesive layer opposite the repositionable adhesive layer and the base substrate so as to cover the permanent adhesive layer. The nature of the release surface is such that the base substrate and the structure providing the release surface can be moved apart from one another so as to separate the release surface from the permanent adhesive layer and leave both of the adhesive layers on the base substrate with the permanent adhesive layer exposed, thereby enabling the selected substrate to be adhesively bonded to the exposed permanent adhesive layer. The adhesive layers are provided such that, after the selected substrate has been adhesively bonded to the permanent adhesive layer, th…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.