Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same
US6403221B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2000 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Oct 13, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31529
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Epoxy resin compositions which comprise, as essential components, (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenolic curing agent, (C) a phenoxy resin containing a bisphenol S skeleton and having a weight average molecular weight of 5,000 to 100,000, and (D) a curing accelerator, are useful for making adhesive films formed by coating the epoxy resin composition on a supporting base film. Such compositions are also useful for making prepregs, by coating and/or impregnating a sheet-shaped reinforced base material made of a fiber with the resin composition, as well as multilayer printed-wiring boards made with such prepregs. Such epoxy resin compositions are also useful for forming conductor layers with excellent adhesiveness without requiring, in the insulating layer, a roughening component which deteriorates performance, as well as multilayer printed-wiring boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.