Circuit-forming charging powder and multilayer wiring board using the same
US6403272B1 · kind B1 · utility
5Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2000 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Nov 17, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit-forming charging powder allowing circuit patterns to resist being peeled off a printing object when the powder is used for printing a circuit pattern by an electrophotographic method on the object, wherein the circuit-forming charging powder has a conductive metal powder, a charge control agent and an adhesion reinforcing agent combined with a heat-melt resin and a method for producing the circuit-forming charging powder, as well as printed objects and multilayer wiring boards are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.