Electronic component package assembly and method of manufacturing the same
US6403881B1 · kind B1 · utility
41Cited by
4References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 26, 1999 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Aug 26, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component package assembly includes a substantially planar base substrate having a plurality of cavities each defined by a frame; an electronic component attached to the base substrate within each cavity; and a lid fixed to the frame such that, in combination, the base, the lid and each frame define an enclosed volume housing the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.