Laser processing apparatus and method
US6403920B1 · kind B1 · utility
10Cited by
3References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2000 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Feb 1, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0026
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a laser processing apparatus, laser beams are respectively focused and irradiated by focusing devices onto a work being processed, thereby performing laser processing in processing areas B within predetermined ranges on the work. An adjustment member is provided for automatically adjusting an interval C between the center points of the focusing devices in correspondence with the size of an entire processing area A on the work being processed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.