Subcarrier and semiconductor device
US6404042B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1999 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Dec 27, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/93
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A chip mount structure called “subcarrier” and semiconductor device capable of efficiently retaining the temperature of a semiconductor element at a constant level by a Peltier cooler without degrading the signal transmission characteristics of a module even when the atmospheric environment for use in the module changes in outside air temperature are provided. The subcarrier includes an element support unit that is high in thermal conductivity and also an element wiring unit of low thermal conductivity. Increasing the thermal conductivity of element support unit makes it possible to provide superior heat conduction between the semiconductor element and Peltier cooler whereas decreasing the element wiring unit's thermal conductivity enables elimination of radiation and absorption or exchange of heat from the top and side surfaces thereof, which in turn leads to an ability to greatly suppress or minimize the thermal load relative to the Peltier cooler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.