Semiconductor device and structure and method for mounting the same
US6404062B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2000 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Jan 27, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor chip, solder balls, a printed wiring substrate on which the semiconductor chip is provided and which serves to electrically connect the semiconductor chip and the solder balls. When such a semiconductor device is mounted on a motherboard, at least one through-aperture is in advance formed on the printed wiring substrate oppositely to the semiconductor chip. After the solder balls are soldered to the motherboard, an under-filler is introduced from either of a space between the semiconductor chip and the printed wiring substrate or a space between the printed wiring substrate and the motherboard, thus flowing from one space into the other space via the through-aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.