Semiconductor device and process for manufacturing the same
US6404066B1 · kind B1 · utility
12Cited by
8References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2000 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Sep 6, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15747
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip is bonded with a polyimide bonding agent to a lead frame of a copper alloy which has been plated with copper. The electrode of the semiconductor chip is connected to each terminal of the lead frame with a wire mainly comprising gold or copper and bonded portions between the semiconductor chip and the wires and between the lead frame and the wires are sealed with a resin. Thus, a semiconductor device can be manufactured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.