Radiator mechanism for information processor
US6404627B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2000 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Apr 18, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/203
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
It is an exemplified object of the present invention to provide a radiator mechanism that efficiently radiates the heat around circuit elements in a compact and lightweight information processor. In order to achieve the above object, in the information processor divided into a display body and a keyboard body via a hinge portion, the keyboard body includes in parallel from a front side in sequence a palm rest section and a keyboard section, a circuit element as a heat source in a housing of the keyboard body, a radiator plate on the circuit element, a first heat pipe between the circuit element and the radiator plate, and the first heat pipe that is connected with a radiator portion that extend from the radiator plate out of the keyboard section, and radiates the heat from the circuit element. According to such a structure, the first heat pipe transfers the heat from the circuit element to the radiator portion in the radiator plate, radiating the heat effectively and efficiently.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.