Integrated power electronics cooling housing
US6404628B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2000 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Oct 16, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20927
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A power electronics cooling housing for use in a power electronics system. The power electronics cooling housing has a body with a coolant cavity formed in one surface and a capacitor bus assembly potting cavity formed in an opposite surface. A bus bar passthrough opening is formed through the body. The bus bar passthrough opening provides an opening from the coolant cavity and the capacitor bus assembly potting cavity. A coolant inlet manifold having a coolant cavity inlet and a coolant outlet manifold having a coolant cavity outlet are formed in the body that are coupled to respective ends of the coolant cavity. An environmental sealing gasket surrounds the coolant cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.