Mechanical retention system for braze and solder joints
US6405918B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2000 |
| Grant date | Jun 18, 2002 |
| Priority date | — |
| Expiry date | Dec 28, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Brazing or soldering of pieces of low wettable materials (1, 3), such as single crystal silicon, is accomplished by sandwiching the brazing material (5) between the pieces and sealing the edges of the brazing material with a tape (11) wrapped about the periphery of the brazing material, mechanically placing that tape in compression and maintaining that compression while heating (21) the sandwiched assembly to the brazing temperature of the brazing material. The tape possesses the characteristic of being non-wettable by the brazing material in the molten state and, hence, is impermeable to that melt. The tape may comprise a fibrous porous ceramic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.