Thermal head and method of manufacturing the same
US6407764B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 1998 |
| Grant date | Jun 18, 2002 |
| Priority date | — |
| Expiry date | Aug 18, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49083
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An wear-resistant layer 50 constituting a printing surface which is brought into contact with a thermal record medium is formed on a provisional substrate 70 having a groove formed in its surface, said groove having a substantially semicircular cross section, and a heat generating layer 51, electrically conductive layers 52a and 52b electrically connected to the heat generating layer, a protection layer 54a and a heat storage layer 58 are stacked in turn to form a printing section. Next, a driving IC 55 for controlling a heating electric power to be supplied to the printing section is connected to the electrically conductive layer and a wiring section 53 for connecting the driving IC to an external circuit is provided. Thereafter, the printing section is secured to a heat dissipating member 59 by means of a resin 62, and a common electrode 84 and wires 56 are secured to the heat dissipating member by means of both-sided adhesive tapes 82 and 83. After covering an assembly with an etching resist 85 except for the substrate 70, the substrate is removed by etching and the printing surface protruded outwardly is exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.