Patent · US Expired

Electrical enclosure having improved sealing and shielding component and method of manufacture thereof

US6408506B1 · kind B1 · utility

1Cited by
13References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 28, 2001
Grant dateJun 25, 2002
Priority date
Expiry dateFeb 28, 2021

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49146
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

An electrical enclosure having an improved sealing and shielding component and a method of manufacturing such an enclosure is provided. In accordance with an embodiment of the invention, a wire mesh is positioned against the surface of the enclosure. While the wire mesh is being positioned against the enclosure surface, a foam is formed on the enclosure surface adjacent the wire mesh. The foam generally adheres to the enclosure surface and holds the wire mesh in place. In accordance with one aspect of the invention, the foam has a height equal to or greater than the height of the wire mesh. The improved sealing and shielding components can, for example, improve the sealing and shielding of the electrical enclosure as compared to conventional electrical enclosures. The present electrical enclosure may, for example, also reduce the cost of manufacturing electrical enclosures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.