Patent · US Expired

Filament forming apparatus and a cooling apparatus for and method of inducing a uniform air flow between a filament forming area and the cooling apparatus

US6408654B1 · kind B1 · utility

7Cited by
28References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 9, 1999
Grant dateJun 25, 2002
Priority date
Expiry dateJun 9, 2019

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P40/57
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A filament forming apparatus and cooling apparatus for and method of inducing a uniform air flow between a filament forming area beneath a bushing and the cooling apparatus are disclosed. The cooling apparatus includes an air housing extending beneath the bushing. The air housing has a top wall and side walls defining an air chamber therebetween.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.