Cooling module
US6408934B1 · kind B1 · utility
27Cited by
13References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 1999 |
| Grant date | Jun 25, 2002 |
| Priority date | — |
| Expiry date | May 26, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A cooling module is disclosed which comprises a plate, a flat heat pipe, a directional motor, and a fin structure, wherein at least a part of the heat pipe is embedded into the plate while being flush with plate, and the heat pipe is disposed close to a heat generating object and a coupling portion of the fin structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.