Apparatus for gripping ceramic substrates
US6409241B1 · kind B1 · utility
4Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2000 |
| Grant date | Jun 25, 2002 |
| Priority date | — |
| Expiry date | Oct 13, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S294/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus is disclosed for the aligning of ceramic carrier substrates on base substrates. The apparatus is a gripper having angled faces lined with soft metallic pads embedded with diamonds that engage in a vertical direction with microfeatures in the ceramic carrier of a semiconductor, providing a secure grip throughout alignment and bonding to a base substrate and providing a gentle release upon disengagement. The gripper is typically detachably affixed to a micromanipulator to provide controlled motion and is spring mounted to provide self adjustment to variations in ceramic carrier substrate thickness and angle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.