Apparatuses and methods for adjusting a substrate centering system
US6409463B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2000 |
| Grant date | Jun 25, 2002 |
| Priority date | — |
| Expiry date | Feb 8, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/973
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatuses and methods for use in adjusting a substrate centering system to center a substrate on a rotatable chuck in a semiconductor processing machine, the chuck including at least one reference point. One apparatus comprises a plate configured to be placed on the chuck and at least one centering mark formed on the plate, wherein the at least one centering mark is configured so that it may be compared to the at least one reference point on the chuck to determine if the plate is centered. The plate often is at least partially transparent so that its position relative to the at least one reference point on the chuck may be seen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.