Extrusion die assembly
US6409491B1 · kind B1 · utility
7Cited by
13References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2001 |
| Grant date | Jun 25, 2002 |
| Priority date | — |
| Expiry date | Feb 2, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C48/10
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is an improved extrusion die assembly for controlling the flow of polymer in a melt extrusion process. The die assembly is useful for extruding low molecular weight polymer melts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.