Connector molding method and shielded waferized connector made therefrom
US6409543B1 · kind B1 · utility
353Cited by
9References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2001 |
| Grant date | Jun 25, 2002 |
| Priority date | — |
| Expiry date | Jan 25, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/6587
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A high speed, high density electrical connector. The connector is assembled from wafers. Each wafer is formed by molding a first dielectric housing over a shield plate. Signal contacts are inserted into the first dielectric housing and a second housing is overmolded on the first housing. Features are employed to lock the first and second housings together with the shield plate to provide a mechanically robust subassembly. The connector as formed has a good electrical properties, including precise impedance control and low cross talk.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.