Methods for treating aluminum substrates and products thereof
US6410197B1 · kind B1 · utility
8Cited by
15References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 18, 1998 |
| Grant date | Jun 25, 2002 |
| Priority date | — |
| Expiry date | Sep 18, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03G5/102
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods of forming a conductive aluminum substrate comprise anodizing a surface of an aluminum substrate to form a porous alumina surface layer, contacting the alumina surface layer with a liquid dispersion or solution of a polymer or at least one polymer-forming component, under conditions sufficient for the polymer to seal pores of the alumina surface layer, and removing excess polymer from the alumina surface layer. The resulting sealed conductive aluminum substrate is useful in photoconductors, for example of the dual layer type.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.