Use of high hydroxyl compounds for water sensitive hot melt adhesives
US6410627B1 · kind B1 · utility
9Cited by
42References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 9, 1999 |
| Grant date | Jun 25, 2002 |
| Priority date | — |
| Expiry date | Apr 9, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/34
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A hot melt adhesive composition comprising (a) greater than 40% by weight of a polymeric component; and (b) 5 to 40% by weight of a high hydroxyl number compound, with hydroxyl number greater than 100 mg KOH/g.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.