One-pack type curable resin composition
US6410640B1 · kind B1 · utility
23Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2000 |
| Grant date | Jun 25, 2002 |
| Priority date | — |
| Expiry date | Mar 29, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S528/901
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A one-pack type curable resin composition having high adhesive strength to various substrates, good storage stability and excellent restoring properties is disclosed. The one-pack type curable resin composition contains an organic polymer (a) having at least one reactive silicon group per molecule, a compound (b) having reactive silicon group in its molecule, a non-phthalate plasticizer (c) having no phthalate structure in its molecule, and a stannous curing catalyst (d).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.