Resin composition for insulating material, and insulating material produced from said resin composition
US6410677B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2000 |
| Grant date | Jun 25, 2002 |
| Priority date | — |
| Expiry date | Sep 27, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02282
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides an insulating material showing excellent thermal propeties and electrical properties in semiconductor applications. That is, the present invention provides: a resin composition for insulating material, comprising, as essential components: (A) a compound having an amphiphatic property, and (B) a heat-resistant resin having a glass transition temperature higher than thermal decomposition temperature of the compound (A), or a precursor thereof; and an insulating material produced by a process which comprises steps of; allowing, in the above resin composition for insulating material, the compound (A) and the heat-resistance resin or the precursor thereof (B) to form a structure of separated phases, and then heat-treating the resulting resin composition at a temperature higher than thermal decomposition temperature of the compound (A) but lower than glass transition temperature of the heat-resistant resin (B) or the heat-resistant resin obtained by ring closure of the precursor thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.