Packaged electronic system having selectively plated microwave absorbing cover
US6410847B1 · kind B1 · utility
19Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2000 |
| Grant date | Jun 25, 2002 |
| Priority date | — |
| Expiry date | Jul 25, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged electronic system is formed of a base having a surface and a plurality of discrete electronic components disposed on the base surface. An absorbing cover reduces the electromagnetic resonance produced by the discrete electronic components disposed within the packaged system. The entire cover is molded using a composite electromagnetic wave-absorbing plastic material. The cover is selectively plated to satisfy the shielding requirements of the packaged system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.