Method and apparatus for release and optional inspection for conductive preforms placement apparatus
US6412685B2 · kind B2 · utility
23Cited by
25References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 11, 1999 |
| Grant date | Jul 2, 2002 |
| Priority date | — |
| Expiry date | May 11, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49147
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are disclosed for releasing solder spheres during the locating and/or placing of a pattern of conductive preforms 32 on a respective pattern of electronic pads 14 on a receiving substrate 12 for such uses as a Ball Grid Array component 24. The release mechanisms are of either compliant mechanical 11, vibratory 90, air pressure 100 or 120, or sound pressure waves 140. Additionally, a method and apparatus is disclosed for the electrical inspection for presence or absence of the complete pattern of conductive preforms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.