Flexible IC module and method of its manufacture, and method of manufacturing information carrier comprising flexible IC module
US6412701B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 1999 |
| Grant date | Jul 2, 2002 |
| Priority date | — |
| Expiry date | Jan 5, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/189
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
There is a flexible IC module utilizable for the production of contactless IC cards and a method for producing an information carrier using the flexible IC module. An IC chip 1 and a coil 2 are embedded in a flexible substrate 3 comprising a nonwoven fabric or the like having compressibility in the thickness direction, self-pressure bonding property and resin impregnation property. This flexible IC module is produced in the following procedure. {circle around (1)} A first nonwoven fabric 12 having compressibility in the thickness direction, self-pressure bonding property and resin impregnation property is placed on a bottom force 11. {circle around (2)} An IC chip and a coil are placed on the first nonwoven fabric after positioning them. {circle around (3)} A second nonwoven fabric 13 is superposed on the IC chip and coil. {circle around (4)} A top force 14 is pressed onto the second nonwoven fabric, and the first and second nonwoven fabrics, the IC chip and the coil are integrated by hot pressing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.