Measuring device

US6413474B1 · kind B1 · utility

Assignee

• Micronas GmbH · DE

Inventors

• Gunter Igel · Teningen, DE
• Ulrich Sieben · Meßkirch, DE
• Jürgen Giehl · Kirchzarten, DE
• Bernhard Wolf · Poing, DE

Key dates

• Filing date: Nov 17, 1999
• Grant date: Jul 2, 2002
• Expiry date: Nov 17, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/00014
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A measuring device (1) has a semiconductor arrangement, which includes a semiconductor chip (2) connected to a carrier (4) having at least one through-hole (3). The semiconductor chip (2) has at least one sensor (6) with an active sensor surface (5) facing the through-hole (3). The semiconductor chip (2) has electrical terminal points (9), which are connected using flip-chip connections (10) to terminal contacts (11) facing the terminal points (9) and located on the carrier (4). The carrier (4) has electrical strip conductors (12), which connect the terminal contacts (11) to contact elements (13) located on the carrier. To the rear side of the carrier (4) having the contact elements (13) a strip conductor carrier (16) is provided, which has strip conductors (12) connected to opposing contacts (14). The opposing contacts (14) are each electrically connected using flip-chip connections (17), to a contact element (13), which are allocated to each of them. The semiconductor chip (2) and the carrier (4) enclose a measuring chamber. Between the carrier (4) and the semiconductor chip (2) a seal (7) is arranged, which is constructed to be porous or semi-porous, at least in certain areas, o…