Semiconductor copper bond pad surface protection
US6413576B1 · kind B1 · utility
8Cited by
3References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 1999 |
| Grant date | Jul 2, 2002 |
| Priority date | — |
| Expiry date | Oct 5, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for protecting the surface of an uninsulated portion of a copper circuit from environmental contamination detrimental to joining the surface to another metal surface, said method comprising the step of coating the surface with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when the surfaces are being joined to obtain metal-to-metal contact between the surfaces. Coated electronic packages including semiconductor wafers are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.