Ceramic wiring substrate and method of producing the same
US6413620B1 · kind B1 · utility
44Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2000 |
| Grant date | Jul 2, 2002 |
| Priority date | — |
| Expiry date | Jun 29, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Wiring substrate including an insulating substrate made of glass ceramics and having Young's modulus of 120 GPa or less, and a wiring circuit layer made of a high-purity metal conductor in concentration of 99% by weight or more formed on the surface of the insulating substrate and/or inside thereof. This wiring substrate may be a multi-layer wiring substrate that has a plurality of wiring circuit layers. The wiring circuit layer is preferably made of a metal foil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.