Semiconductor device and method for making the same
US6413797B2 · kind B2 · utility
18Cited by
10References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2000 |
| Grant date | Jul 2, 2002 |
| Priority date | — |
| Expiry date | Dec 15, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor chip having a main surface formed with an electrode pad, a package containing the semiconductor chip, a component element connected with the electrode pad within the package, a gold bump formed on the electrode pad, and a gold connecting member. The gold connecting member has an end bonded to the gold bump, and the other end bonded to the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.