Polycarbonate molding materials exhibiting improved mechanical properties
US6414107B1 · kind B1 · utility
8Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2001 |
| Grant date | Jul 2, 2002 |
| Priority date | — |
| Expiry date | Jun 1, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L51/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic polycarbonate molding composition is described. The thermoplastic composition contains a silicon compound, e.g., silicon dioxide, having an average particle diameter of 0.001 &mgr;m to 10 &mgr;m. The silicon compound is present in the composition in an amount of 0.01 to 30 parts by weight per 100 parts by weight of the thermoplastic polycarbonate. Also describe are shaped articles, e.g., data technology housing components, made from the thermoplastic polycarbonate composition of the present invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.