Integral dielectric heatspreader
US6414847B1 · kind B1 · utility
17Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2001 |
| Grant date | Jul 2, 2002 |
| Priority date | — |
| Expiry date | Apr 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Integral dielectric heatspreader for transferring heat from semiconductor devices. A semiconductor device is mounted to a thermally conductive electrically insulating substrate, which forms the integral dielectric heatspreader. The heatspreader is then mounted to a package or a lower cost substrate such as a printed circuit board. The integral dielectric heatspreader may also support integral transmission lines, resistors, capacitors, or other bulk components. Performance of the heatspreader is enhanced through the use of thermal vias on a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.